- This analysis shows the thermal expansion and stress distribution of a typical audio-amplifier transistor when it is molded in PPS instead of epoxy resin, the material for which it was originally designed.
- As the transistor begins to heat under electrical load, the lower metal section (shown in purple) expands. As more current flows through the circuit it begins to heat the upper resinous section of the transistor.
- The deformation is magnified 30X.
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